Patent
1990-04-30
1992-03-24
Hille, Rolf
357 80, 357 81, H01L 2334, H01L 2314, H01L 2348
Patent
active
050993097
ABSTRACT:
A memory card structure is disclosed containing an embedded three dimensional array of semiconductor memory chips. The card structure includes at least one memory core and at least one power core which are joined together in an overlapping relationship. Each memory core comprises a copper-invar-copper thermal conductor plane having a two dimensional array of chip well locations on each side of the plane. Polytetrafluoroethylene covers the major surfaces of the thermal conductor plane except at the bottoms of the chip wells. Memory chips are placed in the chip wells and are covered by insulating and wiring levels. Each power core comprises at least one copper-invar-copper electrical conductor plane and polytetrafluoroethylene covering the major surfaces of the electrical conductor plane.
Provision is made for providing electrical connection pathways and cooling pathways along vertical as well as horizontal planes internal to the card structure.
REFERENCES:
patent: 4688648 (1987-08-01), Sorel
patent: 4763188 (1988-08-01), Johnson
patent: 4862249 (1989-08-01), Carlson
patent: 4894706 (1990-01-01), Sato et al.
patent: 4956694 (1990-09-01), Eide
IBM Technical Disclosure Bulletin, vol. 18, No. 10, Mar. 1976, K. C. Joshi et al., "High Density Bubble Memory Package" pp. 3184-3185.
Clark Sheila V.
Hille Rolf
International Business Machines - Corporation
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