Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2010-09-09
2011-11-08
Smith, Zandra (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S109000, C257SE21511
Reexamination Certificate
active
08053277
ABSTRACT:
A semiconductor structure includes a first die comprising a first substrate and a first bonding pad over the first substrate, a second die having a first surface and a second surface opposite the first surface, wherein the second die is stacked on the first die and a protection layer having a vertical portion on a sidewall of the second die, and a horizontal portion extending over the first die.
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Chiou Wen-Chih
Tu Hung-Jung
Wu Weng-Jin
Yang Ku-Feng
Yu Chen-Hua
Slater & Matsil L.L.P.
Smith Zandra
Taiwan Semiconductor Manufacturing Company , Ltd.
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