Three dimensional integrated circuits

Details Three dimensional integrated circuits Three dimensional integrated circuits

2008-10-20

2010-02-02

Tran, Anh Q (Department: 2819)

Electronic digital logic circuitry

Multifunctional or programmable

Array

C326S039000, C326S041000

Reexamination Certificate

active

07656192

ABSTRACT:
A programmable integrated circuit (IC), comprising: a programmable logic circuit configured by a first control signal coupled to a gate electrode of a transistor in the logic circuit; and a first plurality of read only memory (ROM) elements capable of coupling to the first control signal, wherein a said first ROM elements is selected to couple by one or more decode signals, and wherein the first ROM elements store a plurality of user specifications.

REFERENCES:
patent: 5781031 (1998-07-01), Bertin et
patent: 6627985 (2003-09-01), Huppenthal et al.
patent: 2004/0178819 (2004-09-01), New
patent: 2006/0195729 (2006-08-01), Huppenthal
Chen Dong et al., “3-D nFPGA: A reconfigurable architecture for 3-D CMOS/Nanomaterial Hybrid Digital Circuits”, IEEE Trans. Circuits and Systems, vol. 54, No. 11, Nov. 1, 2007 (pp. 2489-2501).

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