Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
Reexamination Certificate
2006-01-10
2006-01-10
Fourson, George (Department: 2823)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Thinning of semiconductor substrate
C438S977000, C438S107000, C156S155000, C156S182000, C148SDIG012
Reexamination Certificate
active
06984571
ABSTRACT:
A device integration method and integrated device. The method includes the steps of polishing surfaces of first and second workpieces each to a surface roughness of about 5–10 Å. The polished surfaces of the first and second workpieces are bonded together. A surface of a third workpiece is polished to the surface roughness. The surface of the third workpiece is bonded to the joined first and second workpieces. The first, second and third workpieces may each be a semiconductor device having a thin material formed on one surface, preferably in wafer form. The thin materials are polished to the desired surface roughness and then bonded together. The thin materials may each have a thickness of approximately 1–10 times the surface non-planarity of the material on which they are formed. Any number of devices may be bonded together, and the devices may be different types of devices or different technologies.
REFERENCES:
patent: 3423823 (1969-01-01), Ansley
patent: 3488834 (1970-01-01), Baird
patent: 3508980 (1970-04-01), Jackson, Jr. et al.
patent: 3534467 (1970-10-01), Sachs et al.
patent: 3579391 (1971-05-01), Buie
patent: 3587166 (1971-06-01), Alexander
patent: 3602981 (1971-09-01), Kool
patent: 3607466 (1971-09-01), Miyazaki
patent: 3640807 (1972-02-01), Van Dijk
patent: 3647581 (1972-03-01), Mash
patent: 3888708 (1975-06-01), Wise et al.
patent: 4416054 (1983-11-01), Thomas et al.
patent: 4612083 (1986-09-01), Yasumoto et al.
patent: 4617160 (1986-10-01), Belanger et al.
patent: 4649630 (1987-03-01), Boland et al.
patent: 4754544 (1988-07-01), Hanak
patent: 4829018 (1989-05-01), Wahlstrom
patent: 4962879 (1990-10-01), Goesele et al.
patent: 4963505 (1990-10-01), Fujii et al.
patent: 4970175 (1990-11-01), Haisma et al.
patent: 4978421 (1990-12-01), Bassous et al.
patent: 4983251 (1991-01-01), Haisma et al.
patent: 5024723 (1991-06-01), Goesele et al.
patent: 5034343 (1991-07-01), Rouse et al.
patent: 5070026 (1991-12-01), Greenwald et al.
patent: 5071792 (1991-12-01), Van Vonno et al.
patent: 5081061 (1992-01-01), Rouse et al.
patent: 5087585 (1992-02-01), Hayashi
patent: 5089431 (1992-02-01), Slatter et al.
patent: 5121706 (1992-06-01), Nichols et al.
patent: 5162251 (1992-11-01), Poole et al.
patent: 5183783 (1993-02-01), Ohta et al.
patent: 5196375 (1993-03-01), Hoshi
patent: 5266511 (1993-11-01), Takao
patent: 5270261 (1993-12-01), Bertin et al.
patent: 5272104 (1993-12-01), Schrantz et al.
patent: 5321301 (1994-06-01), Sato et al.
patent: 5324687 (1994-06-01), Wojnarowski
patent: 5354695 (1994-10-01), Leedy
patent: 5362659 (1994-11-01), Cartagena
patent: 5376579 (1994-12-01), Annamalai
patent: 5380681 (1995-01-01), Hsu
patent: 5407856 (1995-04-01), Quenzer et al.
patent: 5421953 (1995-06-01), Nagakubo et al.
patent: 5427638 (1995-06-01), Goetz et al.
patent: 5432729 (1995-07-01), Carson et al.
patent: 5441591 (1995-08-01), Imthurn et al.
patent: 5441911 (1995-08-01), Malhi
patent: 5459104 (1995-10-01), Sakai
patent: 5460659 (1995-10-01), Krut
patent: 5485540 (1996-01-01), Eda
patent: 5489554 (1996-02-01), Gates
patent: 5497033 (1996-03-01), Filion et al.
patent: 5503704 (1996-04-01), Bower et al.
patent: 5514235 (1996-05-01), Mitani et al.
patent: 5516727 (1996-05-01), Broom
patent: 5517754 (1996-05-01), Beilstein, Jr. et al.
patent: 5534465 (1996-07-01), Frye et al.
patent: 5546494 (1996-08-01), Eda
patent: 5548178 (1996-08-01), Eda et al.
patent: 5561303 (1996-10-01), Schrantz et al.
patent: 5563084 (1996-10-01), Ramm et al.
patent: 5567657 (1996-10-01), Wojnarowski et al.
patent: 5569620 (1996-10-01), Linn et al.
patent: 5580407 (1996-12-01), Haisma et al.
patent: 5591678 (1997-01-01), Bendik et al.
patent: 5647932 (1997-07-01), Taguchi et al.
patent: 5650353 (1997-07-01), Yoshizawa et al.
patent: 5652436 (1997-07-01), Stoner et al.
patent: 5653019 (1997-08-01), Bernhardt et al.
patent: 5661316 (1997-08-01), Kish, Jr. et al.
patent: 5661901 (1997-09-01), King
patent: 5666706 (1997-09-01), Tomita et al.
patent: 5668057 (1997-09-01), Eda et al.
patent: 5672240 (1997-09-01), Stoner et al.
patent: 5673478 (1997-10-01), Beene et al.
patent: 5698471 (1997-12-01), Namba et al.
patent: 5741733 (1998-04-01), Bertagnolli et al.
patent: 5747857 (1998-05-01), Eda et al.
patent: 5755914 (1998-05-01), Yonehara
patent: 5759753 (1998-06-01), Namba et al.
patent: 5760478 (1998-06-01), Bozso et al.
patent: 5763318 (1998-06-01), Bertin et al.
patent: 5766984 (1998-06-01), Ramm et al.
patent: 5771555 (1998-06-01), Eda et al.
patent: 5783477 (1998-07-01), Kish, Jr. et al.
patent: 5785874 (1998-07-01), Eda et al.
patent: 5793115 (1998-08-01), Zavracky et al.
patent: 5804086 (1998-09-01), Bruel
patent: 5821665 (1998-10-01), Onishi et al.
patent: 5841197 (1998-11-01), Adamic, Jr.
patent: 5849627 (1998-12-01), Linn et al.
patent: 5851894 (1998-12-01), Ramm
patent: 5866942 (1999-02-01), Suzuki et al.
patent: 5869354 (1999-02-01), Leedy
patent: 5872025 (1999-02-01), Cronin et al.
patent: 5877034 (1999-03-01), Ramm et al.
patent: 5877070 (1999-03-01), Goesele et al.
patent: 5877516 (1999-03-01), Mermagen et al.
patent: 5880010 (1999-03-01), Davidson
patent: 5902118 (1999-05-01), Hubner
patent: 5903018 (1999-05-01), Shimawaki
patent: 5904860 (1999-05-01), Nagakubo et al.
patent: 5910699 (1999-06-01), Namba et al.
patent: 5915167 (1999-06-01), Leedy
patent: 5915193 (1999-06-01), Tong et al.
patent: 5920142 (1999-07-01), Onishi et al.
patent: 5936280 (1999-08-01), Liu
patent: 5966622 (1999-10-01), Levine et al.
patent: 5982010 (1999-11-01), Namba et al.
patent: 5990472 (1999-11-01), Rinne
patent: 5991989 (1999-11-01), Onishi et al.
patent: 6004866 (1999-12-01), Nakano et al.
patent: 6018211 (2000-01-01), Kanaboshi et al.
patent: 6048752 (2000-04-01), Linderman
patent: 6071761 (2000-06-01), Jacobs
patent: 6087760 (2000-07-01), Yamaguchi et al.
patent: 6103009 (2000-08-01), Atoji
patent: 6120917 (2000-09-01), Eda
patent: 6133640 (2000-10-01), Leedy
patent: 6143628 (2000-11-01), Sato et al.
patent: 6146992 (2000-11-01), Lauterbach et al.
patent: 6153445 (2000-11-01), Yamazaki et al.
patent: 6153495 (2000-11-01), Kub et al.
patent: 6154940 (2000-12-01), Onishi et al.
patent: 6156624 (2000-12-01), Yamagata et al.
patent: 6165817 (2000-12-01), Akram et al.
patent: 6180496 (2001-01-01), Farrens et al.
patent: 6190778 (2001-02-01), Batz-Sohn et al.
patent: 6197663 (2001-03-01), Chandross et al.
patent: 6198159 (2001-03-01), Hosoma et al.
patent: 6236141 (2001-05-01), Sato et al.
patent: 6246068 (2001-06-01), Sato et al.
patent: 6255731 (2001-07-01), Ohmi et al.
patent: 6255899 (2001-07-01), Bertin et al.
patent: 6270202 (2001-08-01), Namba et al.
patent: 6274892 (2001-08-01), Kub et al.
patent: 6323108 (2001-11-01), Kub et al.
patent: 6448174 (2002-09-01), Ramm
patent: 6562647 (2003-05-01), Zandman et al.
patent: 0209173 (1987-01-01), None
patent: 1130647 (2001-09-01), None
patent: 54116888 (1979-09-01), None
patent: 54155770 (1979-12-01), None
patent: 62031138 (1987-02-01), None
patent: 63237408 (1988-10-01), None
patent: 63246841 (1988-10-01), None
patent: 01259546 (1989-10-01), None
patent: 02177435 (1990-07-01), None
patent: 03070155 (1991-03-01), None
patent: 03101128 (1991-04-01), None
patent: 60167439 (1995-08-01), None
patent: WO 9613060 (1996-05-01), None
patent: WO 9845130 (1998-10-01), None
patent: WO 0126137 (2001-04-01), None
patent: WO 0161743 (2001-08-01), None
Haisma, J., et al., “Silicon-on-Insulator Wafer Bonding-Wafer Thinning Technological Evaluations”, Jap.Journal.Appl.Phys., vol. 28, No. 8 (1989), pp. 1426-1443.
Bruel, M., et al., “Smart Cut: A Promising New SOI Material Technology”, Proceedings 1995 IEEE Int'l SOI Conference, Oct. 1995, pp. 178-179.
Tong, Qin-Yi, et al, “Low Temperature Wafer Direct Bonding”, IEEE 1994, Journal of Microelectomechanical Systems, vol. 3, No. 1, Mar. 1994, pp. 29-35.
Gosele, U., et al, “Semiconductor Wafer Bonding, A Flexible Approach to Materials Combinations in Microelectronics, Micromechanics and Optoelectronics”, 1997 IEEE, pp. 23-32.
Takagi, Hideki, et al, “Low Tempera
Fourson George
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Ziptronix, Inc.
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