Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-09-10
2000-10-24
Gaffin, Jeffrey
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361749, 361803, 361807, 174250, 174254, 174255, 257668, 257620, 257723, H05K 114
Patent
active
061376914
ABSTRACT:
A three dimensional composite circuit board includes a first, second, and third circuit boards and a molding material. The first, second and third circuit board have a plurality of plates which are each folded in order to form a separate cubic shape. The second circuit board has a volume smaller than a volume of the first circuit board so as to be accommodated in the first circuit board, and is coupled to the first circuit board. The third circuit board has a volume smaller than the volume of the second circuit board so as to be accommodated in the second circuit board, and is coupled to the second circuit board. The molding material coats electronic elements which are mounted in the first, second and third circuit boards and brazing portions of the electronic elements to shield the electromagnetic waves generated by the electronic elements. This structure saves installation time required for installing the circuit boards to the appliance, miniaturizes the overall size of the appliance, and reduces cost by re-using the circuit boards which are not damaged. Moreover, the microwave generated from the electronic elements is shielded so that malfunctions of the appliance and harmful effects to human beings can be reduced.
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Foster David
Gaffin Jeffrey
Samsung Electronics Co,. Ltd.
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