Three dimensional assembly using flexible wiring board

Details Three dimensional assembly using flexible wiring board Three dimensional assembly using flexible wiring board

1998-04-29

2000-07-04

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361760, 174254, 439 77, 29830, H05K 100

Patent

active

060847786

ABSTRACT:
A printed circuit, printed wiring board and method of making same which includes a flexible rectangular strip (1) having an interconnect pattern thereon. A plurality of flaps (5, 5'), (7, 7'), (9, 9') of substantially equal length extends laterally from one of the sides of the rectangular strip, at least one flap having a narrow width dimension and the terminal flap having a relatively wide width dimension sufficient to overlap the other flaps. The width of the flaps having a narrow width are sufficient to contact the overlapping flap. A patterned interconnect is disposed on the rectangular strip and extends onto the flaps. A plurality of electrical components (11) is coupled to the interconnect and disposed in the region opposed to the flaps. The narrow flaps extend toward the wider flap and the wide flap extends toward the narrow flaps and extends over the narrow flaps. The interconnects are interconnected on the flaps. The board includes a plurality of layers of electrically insulating material and the patterned interconnect is disposed between the layers of electrically insulating material.

REFERENCES:
patent: 3633189 (1972-01-01), Billawala
patent: 4561709 (1985-12-01), Fukukura
patent: 4711548 (1987-12-01), Arakawa et al.
patent: 4997377 (1991-03-01), Goto et al.
patent: 5117282 (1992-05-01), Salatino
patent: 5204806 (1993-04-01), Sasaki et al.
patent: 5213512 (1993-05-01), Campbell et al.
patent: 5313416 (1994-05-01), Kimura

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