Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent
1999-09-22
2000-10-24
Guay, John
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
257737, 257738, 257774, 257778, 257723, 257724, 257780, 361760, 361767, 361770, 361771, H01L 2302
Patent
active
061371645
ABSTRACT:
A thin, stacked face-to-face integrated circuit packaging structure includes a chips attached to both major surfaces of a rigid interposer, and interconnected by printed wiring traces and vias to external solder ball contacts attached to the interposer.
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Chan Min Yu
Low Siu Waf
Yew Chee Klang
Chambliss Alonzo
Guay John
Honeycutt Gary C.
Telecky Fred
Texas Instruments Incorporated
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