Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate
2007-09-25
2010-10-19
Thai, Luan C (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Electromagnetic or particle radiation
C257S434000, C257S704000, C438S064000
Reexamination Certificate
active
07816750
ABSTRACT:
Thin semiconductor die packages and associated systems and methods are disclosed. A package in accordance with a particular embodiment includes a semiconductor die having die bond sites, a conductive structure positioned proximate to the semiconductor die and having first bond sites and second bond sites spaced apart from the first bond sites, and conductive couplers connected between the first bond sites of the conductive structure and the die bond sites of the semiconductor die. A cover can be positioned adjacent to the semiconductor die, and can include a recess in which the conductive couplers are received.
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Aptina Imaging Corporation
Kramer Levin Naftalis & Frankel LLP
Thai Luan C
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