Thin semiconductor card

Details Thin semiconductor card Thin semiconductor card

1988-07-01

1991-07-09

Hille, Rolf

Registers

Coded record sensors

Particular sensor structure

357 80, 357 72, 357 68, 235488, 235489, 235492, 361392, 361398, H01L 2302, H01L 2312, H01L 3902, H01L 2328

Patent

active

050310267

ABSTRACT:
The reliability of a thin semiconductor card, such as an IC card, is enhanced by stress absorbing part such as deformable part for absorbing externally applied stress, thereby preventing the stress from damaging the card main body, the semiconductor module, or the semiconductor elements. Alternatively, protection is provided by a weaker section, located away from the semiconductor module, that breaks under external stress before the stress can destroy the semiconductor module.

REFERENCES:
patent: 4417413 (1983-11-01), Hoppe et al.
patent: 4463971 (1984-08-01), Hoppe et al.
patent: 4639585 (1987-01-01), Haghiri-Tehrani et al.
patent: 4746392 (1988-05-01), Hoppe
patent: 4764803 (1988-08-01), Ueda

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