Thin printed circuit board for manufacturing chip scale package

Details Thin printed circuit board for manufacturing chip scale package Thin printed circuit board for manufacturing chip scale package

2008-01-29

2008-01-29

Dinh, Tuan T. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S254000, C174S260000, C174S261000, C174S268000, C361S748000, C361S749000, C361S750000, C361S751000, C361S777000, C361S793000

Reexamination Certificate

active

07323642

ABSTRACT:
Provided is a thin printed circuit board (PCB) for manufacturing a chip scale package (CSP). The thin printed circuit board includes a plurality of unit printed circuit boards, each of which is comprised of a circuit pattern, to which a semiconductor chip is adhered, and a substrate surrounding the circuit pattern. The unit printed boards are arranged in a row and includes a support molding, which is spaced a predetermined interval apart from the circuit pattern of each unit printed circuit board on the substrate of each unit printed circuit board and formed in a ring shape along the edge of the thin printed circuit board.

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English language abstract of Korean Publication No. 1998-60522.
English language abstract of Korean Publication No. 2002-53414.
English language abstract of Korean Publication No. 1020020053414.

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