Thin polysilicon resistors

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156657, 437186, 437233, 437247, 437918, H01L 2100

Patent

active

051415976

ABSTRACT:
Polycrystalline silicon resistors are formed by reducing the initial thickness of a poly layer to a magnitude such that the etch end point of the lightly doped resistors is equal to the etch end point of the heavily doped interconnection.

REFERENCES:
patent: 3902926 (1975-09-01), Perloff et al.
patent: 3947866 (1976-03-01), Stellrecht
patent: 4560419 (1985-12-01), Bourassa et al.
patent: 4653176 (1987-03-01), Van Ommen
patent: 4692998 (1987-09-01), Armstrong et al.
patent: 4701241 (1987-10-01), Schlesier

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