Thin oxide dummy tiling as charge protection

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Polycrystalline semiconductor

Reexamination Certificate

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Details

C438S283000, C438S287000, C438S296000, C438S591000, C257SE21660, C257SE21678, C257SE21683

Reexamination Certificate

active

07977218

ABSTRACT:
Novel fabrication methods implement the use of dummy tiles to avoid the effects of in-line charging, ESD events, and such charge effects in the formation of a memory device region region. One method involves forming at least a portion of a memory core array upon a semiconductor substrate that involves forming STI structures in the substrate substantially surrounding a memory device region region within the array. An oxide layer is formed over the substrate in the memory device region region and over the STI's, wherein an inner section of the oxide layer formed over the memory device region region is thicker than an outer section of the oxide layer formed over the STI's. A first polysilicon layer is then formed over the inner and outer sections comprising one or more dummy tiles formed over one or more outer sections and electrically connected to at least one inner section.

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