Thin-laminate panels for capacitive printed-circuit boards and m

Stock material or miscellaneous articles – Structurally defined web or sheet – Edge feature

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Details

428209, 174250, 174255, 174258, B32B 2302

Patent

active

061140155

ABSTRACT:
The present invention provides thin-laminate panels (i.e., thin-laminate panels having dielectric layers of about 0.006 inches or less and conductive layers on either side of the dielectric layer), wherein the edges of the dielectric layers of the panels are free of conductive material, such as copper. The thin-laminate panel is designed to provide necessary capacitance for all or a substantial number of the integrated circuits to be formed thereon. The thin-laminate panels of the present invention may be tested for manufacturing defects, such as short circuits, before further processing of the panels to produce PCBs. "Finishing" methods for shearing sheets of unfinished thin-laminate into the finished thin-laminate panels of the present invention in a manner that does not cause smearing of the conductive material onto the dielectric layer are also provided. To assure that conductive material from the conductive layers of an unfinished thin-laminate panel is not smeared onto the edges of the dielectric layer as the panel is sheared, the plane of rotation of a vertically mounted router bit coincides with the plane defined by the surface of the panel. Securing apparatus or fixtures for securing one or more unfinished thin-laminate panels to a surface for shearing of the edges of the panels to produce the finished thin-laminate panels of the present invention are also provided. The securing apparatus allow unfinished panels to be secured to a surface during the finishing process without the need to drill holes through or otherwise diminish the useful area or portions of the panels.

REFERENCES:
patent: 3555964 (1971-01-01), Fleming
patent: 3768351 (1973-10-01), Stepan
patent: 4103102 (1978-07-01), Klein
patent: 4138924 (1979-02-01), Seebach
patent: 4158987 (1979-06-01), Smith
patent: 4212570 (1980-07-01), Larsson
patent: 4302501 (1981-11-01), Nagashima
patent: 4343088 (1982-08-01), Farley et al.
patent: 4657452 (1987-04-01), Astigiano et al.
patent: 4742615 (1988-05-01), Lopez
patent: 4751146 (1988-06-01), Maeda et al.
patent: 4785137 (1988-11-01), Samuels
patent: 4830554 (1989-05-01), Lopez
patent: 5027505 (1991-07-01), Nakamura et al.
patent: 5079069 (1992-01-01), Howard et al.
patent: 5155655 (1992-10-01), Howard et al.
patent: 5161086 (1992-11-01), Howard et al.
patent: 5261153 (1993-11-01), Lucas
patent: 5692286 (1997-12-01), Barthelemy

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