Thin gold-alloy wire for semiconductor device

Details Thin gold-alloy wire for semiconductor device Thin gold-alloy wire for semiconductor device

1996-05-23

1997-08-19

Choi, Kathleen

Stock material or miscellaneous articles

Coated or structually defined flake, particle, cell, strand,...

Rod, strand, filament or fiber

428606, 428620, 420507, C22C 2800, C22C 502

Patent

active

056586647

ABSTRACT:
This invention provides a thin gold-alloy wire for a semiconductor device capable of improving long term reliability of bonding with an electrode and capable of simultaneously accomplishing reduction of a wire bend and wire flow at the time of resin molding and high looping.
The thin gold-alloy wire contains 50 to 3000 ppm by weight of Mn and the balance comprising gold and unavoidable impurities. Further, the thin gold-alloy wire comprises any of the following combinations 1, 2, 1+2, 2+3 and 1+2+3 when element groups to be added are classified into the following groups 1 to 3:

REFERENCES:
JP63-145729, Taneda et al. English translation Jun. 1988.

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