Thin film transistor array panel and fabricating method thereof

Details Thin film transistor array panel and fabricating method thereof Thin film transistor array panel and fabricating method thereof

2006-05-23

2006-05-23

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S149000, C438S257000

Reexamination Certificate

active

07049215

ABSTRACT:
A method of forming a thin film transistor array panel is described. The thin film transistor array comprises a substrate, a plurality of scan lines, a plurality of gates a plurality of first bonding pads and a plurality of second bonding pads, wherein the first bonding pads are connected with the scan lines. The first bonding pads and the second bonding pads are formed as a part of the first metal layer. The data lines are extended to electrically connected with the second bonding pads via contact windows.

REFERENCES:
patent: 2001/0019125 (2001-09-01), Hong et al.
patent: 2002/0130324 (2002-09-01), Song et al.
patent: 2003/0109126 (2003-06-01), Terasawa et al.
patent: 2004/0029308 (2004-02-01), Kong et al.

Affiliated with

Also associated with

Rating

Thin film transistor array panel and fabricating method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin film transistor array panel and fabricating method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin film transistor array panel and fabricating method thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3550580