Thin film transistor and method of fabricating the same

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S166000, C438S482000, C438S486000, C257SE21415

Reexamination Certificate

active

07601565

ABSTRACT:
A thin film transistor and method of fabricating the same are provided. In the thin film transistor, a seed or a grain boundary exists in a semiconductor layer pattern but not in a junction region. The method includes forming a semiconductor layer pattern. Forming the semiconductor layer pattern includes: forming and patterning a first capping layer on an amorphous silicon layer; forming a second capping layer on the first capping layer pattern; forming a metal catalyst layer on the second capping layer; diffusing the metal catalyst; and crystallizing the amorphous silicon layer to form a polysilicon layer. Therefore, it is possible to prevent that a trap is generated in the junction region, thereby obtaining improved and uniform characteristics of the device.

REFERENCES:
patent: 5534716 (1996-07-01), Takemura
patent: 6080239 (2000-06-01), Noguchi
patent: 6326248 (2001-12-01), Ohtani et al.
patent: 6426246 (2002-07-01), Chang et al.
patent: 6521909 (2003-02-01), Yamaguchi
patent: 6537890 (2003-03-01), Joo et al.
patent: 2002/0001868 (2002-01-01), Joo
patent: 2004/0110329 (2004-06-01), Joo
patent: 07058339 (1995-03-01), None
patent: 07335548 (1995-12-01), None
patent: 10107290 (1998-04-01), None
patent: 10199807 (1998-07-01), None
patent: 2000-133807 (2000-05-01), None
patent: 2001057339 (2001-02-01), None
patent: 1020020033373 (2002-05-01), None
patent: 102003006043 (2003-07-01), None
patent: 1020040040762 (2004-05-01), None
Chinese Office Action dated Apr. 11, 2008, 10 pages.
Japanese Office Action dated Jul. 29, 2008.
Non-Final Office Action dated May 22, 2006 (from copending U.S. Appl. No. 11/017,667).
Final Office Action dated Oct. 19, 2006 (from copending U.S. Appl. No. 11/017,667).
Non-Final Office Action dated Jul. 5, 2007 (from copending U.S. Appl. No. 11/017,667).
Final Office Action dated Dec. 20, 2007 (from copending U.S. Appl. No. 11/017,667).
Notice of Allowance dated Jun. 25, 2008 (from copending U.S. Appl. No. 11/017,667).
Non-Final Office Action mailed May 27, 2009 (from copending U.S. Appl. No. 11/017,667).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thin film transistor and method of fabricating the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin film transistor and method of fabricating the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin film transistor and method of fabricating the same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4059440

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.