Thin film transistor and manufacturing method thereof

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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C438S151000

Reexamination Certificate

active

07314784

ABSTRACT:
A channel-length of a TFT can be controlled with higher reproducibility, and a short channel-length of the TFT can be manufactured. Further, a structure of the TFT having an improved current-voltage characteristic is provided. A thin film transistor has a lamination layer where a first conductive film, a first insulating film and a second conductive film are sequentially laminated, a semiconductor film is formed so as to be in contact with the side surface of the lamination layer, and a third conductive film covers the semiconductor film through a second insulating film. The first conductive film and the second conductive film are a source electrode and a drain electrode, a region which is in contact with the first insulating film and the third conductive film is a channel forming region in the semiconductor film, and the third conductive film is a gate electrode.

REFERENCES:
patent: 4547789 (1985-10-01), Cannella et al.
patent: 4924279 (1990-05-01), Shimbo
patent: 4949141 (1990-08-01), Busta
patent: 7138682 (2006-11-01), Kamata et al.
patent: 2000-275678 (2000-10-01), None
patent: 2001-326356 (2001-11-01), None
patent: 2002-275678 (2002-09-01), None
patent: 2003-318407 (2003-11-01), None

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