Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer
Reexamination Certificate
2006-02-07
2006-02-07
Fourson, George (Department: 2823)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
On insulating substrate or layer
C438S585000
Reexamination Certificate
active
06995048
ABSTRACT:
A first contact hole is formed penetrating a gate insulating film, on which a gate electrode is formed and simultaneously a first contact is formed in the first contact hole. A second contact hole penetrating an interlayer insulating film is formed, and a second contact is formed in the second contact hole. A third contact hole is formed penetrating a planarization film, and an electrode is formed in the third contact hole. By using a plurality of contact holes for electrically connecting the electrode and a semiconductor film, the aspect ratio of each contact hole can be reduced, thereby achieving improvement in yield, high-level integration due to a reduction in difference in area between upper and bottom surfaces of the contact, and other advantageous improvements.
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International Search Report.
Copy of Office Action for corresponding Korean Patent Application No. 10-2003-7000738 dated Nov. 26, 2004 and its excerpt English translation.
Suzuki Koji
Yamada Tsutomu
Yoneda Kiyoshi
Yuda Shinji
Cantor & Colburn LLP
Fourson George
Sanyo Electric Co,. Ltd.
Toledo Fernando L.
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