Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Reexamination Certificate
2011-05-31
2011-05-31
Nguyen, Nam X (Department: 1724)
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
C204S298150, C204S298120
Reexamination Certificate
active
07951272
ABSTRACT:
The present invention is made to provide a method of producing a ZnO thin film in which the c-axis is oriented in-plane over a large area. A ZnO target28as the material of the thin film is sputtered by using a magnetron sputtering system, and a flow of material (material flow) directed from the cathode23to the anode24is generated in a plasma. The material flow has a high density at its central part and has a low density as it departs from the central part. A substrate20is fixed at a position displaced from the central axis of a region30where the material flow is generated so as to be inclined relative to the central axis. Thereby, a temperature gradient is naturally formed on the substrate20, and the c-axis of the ZnO thin film deposited on the substrate20is oriented in-plane to the temperature gradient direction. Since the substrate20is fixed so as to be inclined relative to the material flow, the area where the c-axis is consistently oriented in-plane becomes larger than before.
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Watanabe Yoshiaki
Yanagitani Takahiko
Berman Jason M
Nguyen Nam X
Oliff & Berridg,e PLC
Omron Corporation
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