Thin film or solder ball including a metal and an oxide, nitride

Details Thin film or solder ball including a metal and an oxide, nitride Thin film or solder ball including a metal and an oxide, nitride

1997-11-06

1999-08-31

Hardy, David B.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

438610, H01L 2943

Patent

active

059457376

ABSTRACT:
A device having a thin film and/or a solder ball formed on a substrate. The thin film and the solder ball each include a metal and a compound that includes an oxide, nitride, or carbide precipitate of an expandable element or a contractible element. The compound is distributed in the metal to control the tensile and compressive stresses and mechanical properties of the thin film and the solder ball.

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