Thin film multilayer laminate interconnection board assembly met

Details Thin film multilayer laminate interconnection board assembly met Thin film multilayer laminate interconnection board assembly met

1989-06-02

1990-06-12

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29852, 156634, 156643, 156644, 156645, 156656, 1566591, 156668, 156902, B44C 122, C23F 102, B29C 3700, C03C 1500

Patent

active

049330454

ABSTRACT:
A method of assembling a multilayer laminate interconnection board, particularly boards in which each layer preferably includes copper conductors on polyimide film layers, involves adhesively joining individual layers of wired film initially onto an auxiliary pin carrier substrate and then onto a previously laminated layer. After each layer is aligned and adhesively joined to the immediately preceeding layer, holes are formed through the layer. Metal is deposited into the holes for electrically connecting conductors on the top surface of the last layer to a via located on the immediately preceeding layer. The process is repeated for each layer of the multilayer laminate interconnection board until the entire board is completely assembled. Alternatively, layers containing preformed and metalized holes at the location of a respective via in a particular layer are aligned and adhesively laminated.

REFERENCES:
patent: 3351816 (1967-11-01), Sear et al.
patent: 3436819 (1969-04-01), Lunine
patent: 3751292 (1973-08-01), Kongable
patent: 4439270 (1984-03-01), Powell et al.
patent: 4536951 (1985-08-01), Rhodes et al.
patent: 4541893 (1985-09-01), Knight
patent: 4789423 (1988-12-01), Pelligrino
Gibney et al., "Screening Mask", IBM Technical Disclosure Bulletin, vol. 19, No. 3, p. 930, 8/76.

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