Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate
2007-03-09
2010-06-15
Mulpuri, Savitri (Department: 2812)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
C438S048000, C438S690000, C257SE21499, C216S002000, C216S011000
Reexamination Certificate
active
07736929
ABSTRACT:
Low temperature, multi-layered microshells for encapsulation of devices such as MEMS and microelectronics. The microshells may include a perforated pre-sealing layer, below which a sacrificial layer is accessed, and a sealing layer to close the perforation in the pre-sealing layer after the sacrificial material is removed. The pre-sealing layer includes a large surface area getter layer to remove contaminants from the space ultimately enclosed by the microshell to improve the pressure control and cleanliness of the microshell.
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Howe Roger T.
Monadgemi Pezhman
Quevy Emmanuel P.
Blakely , Sokoloff, Taylor & Zafman LLP
Choi Calvin
Mulpuri Savitri
Silicon Clocks Inc.
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