Thin film metallization for barium nanotitanate substrates

Details Thin film metallization for barium nanotitanate substrates Thin film metallization for barium nanotitanate substrates

1996-10-07

1998-07-14

Jones, Deborah

Etching a substrate: processes

Nongaseous phase etching of substrate

Etching inorganic substrate

216 95, B44C 122

Patent

active

057799296

ABSTRACT:
The specification describes a metallization system for barium nanotitanate substrates that provides a combination of high dielectric properties and excellent metal adhesion. It comprises Ti, Pd or Ti/Pd alloy, and copper.

REFERENCES:
patent: 4902607 (1990-02-01), Lee
patent: 5670062 (1997-09-01), Lin et al.

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