Thin film getter protection

Details Thin film getter protection Thin film getter protection

2006-03-10

2011-10-18

Ghyka, Alexander (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S064000, C257SE21499

Reexamination Certificate

active

08039285

ABSTRACT:
A method for installing a sorption element in a cavity including: disposing, within the cavity, a getter material, a reaction material, and a protective material, the protective material covering at least one part of the getter material so as to bury the at least one part; raising a temperature up to at least one removal temperature; and moving the protective material towards the reaction material by reaction between the protective material and the reaction material so that at least one portion of the part of the getter material is no longer covered with the protective material.

REFERENCES:
patent: 4426769 (1984-01-01), Grabbe
patent: 2003/0138656 (2003-07-01), Sparks
patent: 2004/0189195 (2004-09-01), Allemand
patent: 2000-243281 (2000-09-01), None
patent: WO 02/42716 (2002-05-01), None
Jin Y., et al. “MEMS Vacuum Packaging Technology and Applications”, IEEE Electronics Packaging Technology Conference, 2003, pp. 301-306.
Japanese Office Action issued on Feb. 22, 2011 in corresponding Japanese Application No. 2008-501381 (with an English Translation).

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