Thin film forming method and system

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

Patent

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Details

2041922, 20429803, 20429809, 20429825, 20429826, 198346, C23C 1434, B65G 106

Patent

active

051260271

ABSTRACT:
A thin film forming method includes the steps of preheating a plurality of base plates placed at a first position, sequentially picking up the base plates one by one and positioning a picked-up base plate at a second position, heating the picked-up base plate at the second position so that a temperature of the picked-up base plate becomes approximately equal to a predetermined temperature, moving the picked-up base plate from the second position to a third position, and growing a thin film on a surface of the picked-up base plate at the third position.

REFERENCES:
patent: 4643629 (1987-02-01), Takahaski et al.
patent: 4747928 (1988-05-01), Takahashi et al.
patent: 4832981 (1989-05-01), Yamazaki
patent: 4851101 (1989-07-01), Hutchinson
patent: 4913790 (1990-04-01), Narita et al.
patent: 4952299 (1990-08-01), Chrisos et al.
patent: 4975168 (1990-12-01), Ohno et al.

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