Coating apparatus – Gas or vapor deposition – Work support
Patent
1994-08-12
1997-05-20
Bueker, Richard
Coating apparatus
Gas or vapor deposition
Work support
118725, 118733, C23C 1600
Patent
active
056308817
ABSTRACT:
A thin-film forming device including a reaction chamber having an atmosphere different from that in the outside world, a susceptor rotatably disposed in the reaction chamber for mounting a substrate thereon to form a thin film thereon, and a nozzle disposed within the reaction chamber facing the susceptor for supplying a thin-film forming material on the substrate, the thin-film forming device comprises: a levitating means including magnetic bearings for non-contact support of the susceptor; and a driving means for rotating the susceptor at high speed, to thereby increase the rotational speed of the susceptor and the thin-film forming rate.
REFERENCES:
patent: 4881722 (1989-11-01), Koizumi
patent: 4980204 (1990-12-01), Fujii
patent: 4986216 (1991-01-01), Ohmori
patent: 4997677 (1991-03-01), Wang et al.
patent: 5021697 (1991-06-01), Kralick
patent: 5076877 (1991-12-01), Ueda et al.
patent: 5111102 (1992-05-01), Meeks
patent: 5216308 (1993-06-01), Meeks
patent: 5237229 (1993-08-01), Ohishi
patent: 5302209 (1994-04-01), Maeda
patent: 5338940 (1994-08-01), Takeyama
patent: 5339539 (1994-08-01), Shiraishi
"An Analytical Study of the Chemical Vapor Deposition (CVD) Processes in a Rotating Pedestal Reactor", Journal of Crystal Growth 77, (1986), pp. 199-208, North-Holland, Amsterdam.
Kanemitsu Yoichi
Ogure Naoaki
Bueker Richard
Ebara Corporation
Lund Jeffrie R.
LandOfFree
Thin-film forming apparatus with magnetic bearings and a non-con does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thin-film forming apparatus with magnetic bearings and a non-con, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin-film forming apparatus with magnetic bearings and a non-con will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1721407