Thin film forming apparatus

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

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Details

20429816, 20429825, 20429826, C23C 1434, C23C 1435

Patent

active

060276215

ABSTRACT:
A thin film forming apparatus is formed of a vacuum chamber, a partition for separating the vacuum chamber, two ECR plasma generating devices provided on both sides of the vacuum chamber. A base plate is situated in the partition, and targets are disposed on both sides of the base plate in the vacuum chamber. ECR plasma is formed on both side surfaces of the base place in the vacuum chamber, and ions are caused to collide against the targets to thereby spring out atoms and to form thin films on both side surfaces of the base plate through sputtering.

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