Thin film-forming apparatus

Coating apparatus – Gas or vapor deposition

Reexamination Certificate

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Details

C156S345330

Reexamination Certificate

active

06960262

ABSTRACT:
A thin film formation apparatus by which source gas is supplied uniformly to the surface of a substrate so that an organic thin film of a uniform film thickness can be formed on the surface of the substrate. The thin film formation apparatus includes a vacuum chamber (11), a substrate holder (12) provided in the vacuum chamber (11), and a gas supplying end element (22) for supplying gas toward a substrate mounting face (12a) of the substrate holder (12). The gas supplying end element (22) is formed so as to supply the source gas in an elongated rectangular shape to the substrate mounting face (12a).

REFERENCES:
patent: 3511703 (1970-05-01), Peterson
patent: 4413022 (1983-11-01), Suntola et al.
patent: 4848273 (1989-07-01), Mori et al.
patent: 4993360 (1991-02-01), Nakamura
patent: 5445699 (1995-08-01), Kamikawa et al.
patent: 6359388 (2002-03-01), Petrmichl
patent: RE38358 (2003-12-01), Petrmichl
patent: 2004/0134428 (2004-07-01), Sasaki et al.
patent: 2004/0194702 (2004-10-01), Sasaki et al.
patent: 61-101020 (1986-05-01), None
patent: 62-093922 (1987-04-01), None
patent: 63-162596 (1988-07-01), None
patent: 63-257232 (1988-10-01), None
patent: 04-198483 (1992-07-01), None
patent: 11-323532 (1999-11-01), None
patent: WO 99/25894 (1999-05-01), None

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