Thin film formation use sputtering target material, thin...

Details Thin film formation use sputtering target material, thin... Thin film formation use sputtering target material, thin...

2005-12-06

2005-12-06

McDonald, Rodney G. (Department: 1753)

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

C204S192200, C204S192260, C204S192270

Reexamination Certificate

active

06972076

ABSTRACT:
An alloy material, a thin film and an optical recording medium to achieve various tasks such as maintenance of a high reflectivity, improved corrosion resistance, simplified production of the alloy, and realization of stability and simplicity/easiness of a sputtering process when being used as a sputtering target. An AgPd alloy including Ag as a main component and Pd in the range of 0.5 to 4.9 atomic % is used as a thin film formation use sputtering target material, with the target material a thin film, that is a reflecting film, constituting an optical recording medium is formed and the optical recording medium containing the reflecting film as a constituent is produced.

REFERENCES:
patent: 4647947 (1987-03-01), Takeoka et al.
patent: 5948497 (1999-09-01), Hatwar et al.
patent: 6004646 (1999-12-01), Ohno et al.
patent: 6007889 (1999-12-01), Nee

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