Thin film electronic device

Details Thin film electronic device Thin film electronic device

1990-09-07

1991-10-15

Thompson, Gregory D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361398, 361400, 361406, 361408, H05K 720

Patent

active

050579690

ABSTRACT:
A thin film electronic package which utilizes a circuitized substrate (e.g., a printed circuit board) having a flexible film carrier electrically coupled thereto. The film carrier includes a dielectric layer (e.g., polyimide) with first and second circuit layers located on opposite sides thereof. These circuit layers are interconnected, electrically, through the dielectric. An electronic device (e.g., semiconductor chip) is electrically connected to bridging portions of the conductive leads of the carrier's first circuit layer, which bridging portions extend across apertures provided within the dielectric. A plurality of solder elements are utilized to provide electrical connection between respective contact locations of the electronic device and respective bridging portions of the first layer's conductive leads.

REFERENCES:
patent: 3617682 (1971-11-01), Hall
patent: 3722072 (1973-03-01), Beyerlein
patent: 3754698 (1973-03-01), Bachinski et al.
patent: 3868764 (1975-03-01), Hartleroad et al.
patent: 3868765 (1975-03-01), Hartleroad et al.
patent: 3871015 (1975-03-01), Lin et al.
patent: 3912153 (1975-10-01), Hartleroad et al.
patent: 3937386 (1976-02-01), Hartleroad et al.
patent: 4295596 (1981-10-01), Doten et al.
patent: 4373658 (1983-02-01), March et al.
patent: 4426571 (1984-01-01), Beck
patent: 4435740 (1984-03-01), Huckabee et al.
patent: 4545610 (1985-10-01), Lakritz et al.
patent: 4552300 (1985-11-01), Zovko et al.
patent: 4564135 (1986-01-01), Barresi et al.
patent: 4587596 (1986-05-01), Bunnell
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4605152 (1986-08-01), Fridman
patent: 4646958 (1987-03-01), Howard, Jr.
patent: 4648547 (1987-03-01), Mahler et al.
patent: 4661192 (1987-04-01), McShane
patent: 4681654 (1987-07-01), Clementi et al.
patent: 4720396 (1988-01-01), Wood
patent: 4752025 (1988-07-01), Stach et al.
patent: 4789096 (1988-12-01), Dunn et al.
patent: 4805827 (1989-02-01), Coffman et al.
patent: 4849856 (1989-07-01), Funari et al.
patent: 4890194 (1989-12-01), Derryberry et al.
patent: 4914551 (1990-04-01), Anschel et al.
patent: 4931908 (1990-06-01), Boucard et al.
AT&T Technical Digest No. 75, 9/84, p. 11.
Hot Air Device for Desoldering IC Chip From A PCB.
IBM TDB, vol. 11, No. 10, 3/69, p. 1298, Solder Reflow Tool.
IBM TDB, vol. 15, No. 3, 8/72, pp. 822, 823 Hot Gas Gun.
IBM TDB, vol. 29, No. 11, 4/87, pp. 4717, 4718, Rework Fixture for Surface Mounted Components.

Affiliated with

Also associated with

Rating

Thin film electronic device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin film electronic device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin film electronic device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-995190