4. Metal fusion bonding
  5. Process
  6. Plural joints

John A. Goldfuss, Jr.

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Method for bonding thin film electronic device

Metal fusion bonding – Process – Plural joints
Patent

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Data processing: database and file management or data structures – Database design – Data structure types
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Thin film electronic device

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Patent

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Profile ID: LFUS-PAI-P-639747

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