Thin-film deposition methods and apparatuses

Details Thin-film deposition methods and apparatuses Thin-film deposition methods and apparatuses

2007-06-12

2007-06-12

Meeks, Timothy (Department: 1762)

Coating processes

Coating by vapor, gas, or smoke

Base includes an inorganic compound containing silicon or...

C427S097100, C427S402000

Reexamination Certificate

active

10712444

ABSTRACT:
Described are structures useful in microelectronic or MEMS devices such as atomic clocks, sensors, and RF switches, wherein a first material is deposited onto a substrate to define a first material area of coverage and a second material is deposited over the first material area of coverage to define a second material area of coverage that includes the first material area of coverage and that additionally includes area that surrounds the first material area of coverage, such that the first material is enclosed by the second material over the entire area and past the edges of the first material.

REFERENCES:
patent: 3148085 (1964-09-01), Wiegmann
patent: 3300332 (1967-01-01), Gorham et al.
patent: 3936545 (1976-02-01), Brill et al.
patent: 4434434 (1984-02-01), Bhattacharya et al.
patent: 5641611 (1997-06-01), Shieh et al.
patent: 5657340 (1997-08-01), Camparo et al.
patent: 5805111 (1998-09-01), Brettner, III et al.
patent: 5929515 (1999-07-01), Greiff et al.
patent: 5953587 (1999-09-01), Forrest et al.
patent: 5959338 (1999-09-01), Youngner et al.
patent: 6013538 (2000-01-01), Burrows et al.
patent: 6277666 (2001-08-01), Hays et al.
patent: 6338775 (2002-01-01), Chen
patent: 6358433 (2002-03-01), Tan et al.
patent: 6361206 (2002-03-01), Bonne
patent: 6372154 (2002-04-01), Li
patent: 6426538 (2002-07-01), Knowles
patent: 6550310 (2003-04-01), Liu et al.
patent: 6568286 (2003-05-01), Cabuz
patent: 6570459 (2003-05-01), Nathanson et al.
patent: 6630725 (2003-10-01), Kuo et al.
patent: 6639289 (2003-10-01), Hays
patent: 6900702 (2005-05-01), Youngner et al.
patent: 2003/0087471 (2003-05-01), Shtein et al.
patent: 2003/0138656 (2003-07-01), Sparks
patent: 2004/0038075 (2004-02-01), Wang et al.
patent: 2004/0061136 (2004-04-01), Tyan et al.
patent: 1 319 182 (1963-02-01), None
patent: 1 570 777 (1980-07-01), None
Brown, “RF-MEMS Switches for Reconfigurable Integrated Circuits,” IEEE Transactions on Microwave Theory and Techniques, vol. 46, No. 11, pp. 1868-1880, Nov. 1998.
Kim et al., “Mercury Contact Micromechanical Relays,” Proc. 46thAnnual Int. Relay Conf., Oak Brook, IL, pp. 19-1 to 19-8, Apr. 1998.
Nattland et al., “Interfacial Properties of Liquid Alloys: An Experimental Study on Ga-Bi and Ga-Ge,” Ber. Bunsenges. Phys. Chem. 102, No. 9, 1151-1155, 1998.

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