Fishing – trapping – and vermin destroying
Patent
1991-09-09
1993-08-10
Chaudhuri, Olik
Fishing, trapping, and vermin destroying
437105, 437106, 118724, H01L 2120, H01L 21203
Patent
active
052348628
ABSTRACT:
A thin film deposition method consists of depositing a thin film on a wafer by supplying a reactant gas molecules toward and onto the wafer within a vacuum vessel or chamber. The pressure within the vacuum vessel is set to the pressure under which the mean free path (d) of the molecules contained in the supplied reactant gas can be longer than the shortest distance (L) between the wafer and the wall of the vacuum vessel exposed to the vacuum side, or d>L. The temperature of the wafer is set to the temperature (T sub) at which the reactant gas can cause substantially the thermally decomposing reaction. The temperature of the vacuum side-exposed wall of the vacuum vessel (T wall) is set to a temperature range having the lower limit higher than the temperature (T vap) at which the saturated vapor pressure can be maintained to be equal to the partial pressure of the molecules contained in the reactant gas, and having the upper limit lower than the temperature of the wafer (T sub), or T vap<T wall<T sub.
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Aketagawa Ken-ichi
Murakami Shun-ichi
Murota Hiroyoshi
Sakai Junro
Tatsumi Toru
Anelva Corp.
Chaudhuri Olik
NEC Corp.
Paladugu Ramamohan Rao
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