Thin film deposition apparatus for semiconductor

Coating apparatus – Gas or vapor deposition

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C712S029000, C712S029000, C156S345240, C422S168000

Reexamination Certificate

active

06740166

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a thin film deposition apparatus for a semiconductor, and more particularly, to a semiconductor thin film deposition apparatus which can deposit a thin film, for example, an aluminum oxide film, on a wafer using ozone and also perform thermal treatment using ozone.
2. Description of the Related Art
General thin film deposition apparatuses for depositing a thin film on a wafer use deionized (DI) water vapor as a reaction gas for oxidation. For example, an aluminum oxide film can be formed at a thickness of an atomic layer by continuously introducing DI water vapor and TriMethylAluminum (TMA) gas into a reactor on which a wafer is loaded, and subsequently purging the introduced DI water vapor and TMA reaction gas.
However, when DI water vapor is used, an O—H group exists within a thin film, for example, an aluminum oxide film, formed by a thin film deposition process or by thermal treatment, thus degrading the characteristics of the thin film. That is, H existing in the thin film causes damage to the thin film, thereby degrading the characteristics of the thin film.
SUMMARY OF THE INVENTION
To solve the above problem, an objective of the present invention is to provide a semiconductor thin film deposition apparatus in which the use of ozone as a reaction gas for oxidation prevents defects from being generated within a thin film deposited on a wafer.
To achieve the above objective, the present invention provides a semiconductor thin film deposition apparatus having at least one reactor in which a wafer is received, a gas supply portion for supplying a reaction gas or inert gas to the reactor, and an exhaust pump for exhausting gas from the reactor, characterized in that the improvement comprises an ozone supply portion for generating ozone as a gas that reacts with the reaction gas, and for supplying the ozone to the reactor.


REFERENCES:
patent: 5091207 (1992-02-01), Tanaka
patent: 5290381 (1994-03-01), Nozawa et al.
patent: 5352615 (1994-10-01), Lim et al.
patent: 5470390 (1995-11-01), Nishikawa et al.
patent: 5928428 (1999-07-01), Horie
patent: 5976471 (1999-11-01), Simandl et al.
patent: 6004397 (1999-12-01), Park et al.
patent: 0 861 683 (1998-09-01), None
patent: 56 114809 (1981-09-01), None
patent: 05 234882 (1993-09-01), None
patent: 05 247654 (1993-09-01), None
patent: WO 97/22992 (1997-06-01), None
Abstract for Patent No. 00311218.2.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thin film deposition apparatus for semiconductor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin film deposition apparatus for semiconductor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin film deposition apparatus for semiconductor will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3258525

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.