Thin film DC plasma processing system

Details Thin film DC plasma processing system Thin film DC plasma processing system

1992-12-30

1995-06-27

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429803, 20419213, C23C 1434

Patent

active

054276691

ABSTRACT:
An enhanced DC plasma processing system which acts to immediately stop current from flowing through the plasma allows a variety of alternative embodiments for varying applications. In one embodiment, a tapped inductor is switched to ground to achieve substantial voltage reversal of about 10% upon detection of an arc condition through voltage and/or rate of voltage change techniques. This reversal of voltage is maintained long enough to allow restoration of uniform charge density within the plasma prior to restoration of the initial driving condition. A technique for preventing arc discharges involving periodically applying a reverse voltage is effected through a timer system in the power supply.

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PCT search report mailed Jan. 11, 1994.
A New Technique for Arc Control in DC Sputtering; L. Anderson; 1992; pp. 325-329.
The MDX as a Strategic Tool in Reducing Arcing; Doug Schatz; 1985; pp. 1-7.
Economical Considerations on Modern Web Sputtering Technology; S. Beisswenger, et al.; 1992; pp. 128-134.

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