Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1993-03-29
1994-03-29
Powell, William
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156644, 156655, 156656, 156668, 156902, B44C 122, B29C 3700, C23F 100
Patent
active
052981142
ABSTRACT:
A thin film circuit substrate comprising multilayer conductor layers formed via insulating layers, wherein a signal transmission path in at least one of the conductor layers is embedded in a low dielectric constant insulator, and the low dielectric constant insulator is embedded in an insulator layer with a good adhesiveness. The thin film circuit substrate attains a low dielectric constant, and thus an improved signal propagation velocity, without lowering the interlayer adhesiveness.
REFERENCES:
patent: 4689110 (1987-08-01), Leibowitz
patent: 4970106 (1990-11-01), DiStefano et al.
patent: 5227013 (1993-07-01), Kumar
Fujitsu Limited
Powell William
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