Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Patent
1994-10-04
1996-06-18
Limanek, Robert P.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
257784, 257723, 257924, H01L 2312, H01L 2314, H01L 23522
Patent
active
055280838
ABSTRACT:
An integrated circuit chip and flat capacitor assembly are connected with short bonding wires to reduce electrical noise. A flat chip capacitor is coupled to the chip and includes a first electrode, a second electrode and a dielectric layer disposed between the electrodes. The ground and power bonding pads of an integrated circuit chip are coupled to a number of terminals arranged in a row near the outer edge of the capacitor, where each of the terminals is coupled to one of the electrodes. The terminals of the capacitor are connected to a number of package leads of a lead frame or a other integrated circuit package. The invention includes embodiments in which the chip is placed on top of the capacitor, the capacitor is placed on top of the chip, and a flex circuit of a micro ball grid array is placed on a capacitor which is positioned on a chip.
REFERENCES:
patent: 4945399 (1990-07-01), Brown et al.
patent: 4989117 (1991-01-01), Hernandez
patent: 4994936 (1991-02-01), Hernandez
patent: 5049979 (1991-09-01), Hashemi et al.
patent: 5103283 (1992-04-01), Hite
patent: 5134539 (1992-07-01), Tuckerman et al.
patent: 5274270 (1993-12-01), Tuckerman
patent: 5311057 (1994-05-01), McShane
Hashemi et al., "The Close Attached Capacitor: A Solution to Switching Noise Problems," IEEE, May 1992.
Loo et al., "Area Array Chip Carrier: SMT Package for Known Good Die," ISHM 1993 Proceedings.
Matthew et al., "Future Directions in TAB: The TCC/MCM Interconnect," Tessera, Inc.
"Tessera Compliant Chip Technology Overview," Tessera, Inc.
Bogatin Eric L.
Malladi Deviprasad
Zand Bahram
Hardy David B.
Limanek Robert P.
Sun Microsystems Inc.
LandOfFree
Thin film chip capacitor for electrical noise reduction in integ does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thin film chip capacitor for electrical noise reduction in integ, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin film chip capacitor for electrical noise reduction in integ will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-224920