Thin film analyzing method

Details Thin film analyzing method Thin film analyzing method

2006-07-18

2006-07-18

Lee, John R. (Department: 2881)

Radiant energy

Inspection of solids or liquids by charged particles

C250S307000, C250S310000, C250S309000

Reexamination Certificate

active

07078687

ABSTRACT:
The present invention provides is a thin film analyzing method which can be applied to various fields, and which makes it possible to detect and analyze in a simple manner, with high precision, a distribution of a specific component in a thin film formed on a support. The method for analyzing a constituent of a thin film comprises a cutting step of cutting the thin film obliquely, and an analyzing step of analyzing a specific component in the cut section of the thin film. In this cutting step, the thin film is preferably cut with a microtome to which a cutting edge made of glass is fitted knife made of glass. The analysis of the distribution of the specific component in the cut section is suitably analyzed by TOF-SIMS or μ-ESCA. The method is particularly useful for analyzing an image recording layer of a planographic printing plate precursor which comprises a water-insoluble and alkali-soluble resin, an infrared ray absorber, and a colorant.

REFERENCES:
patent: 4153330 (1979-05-01), Tomlinson, III
patent: 4858556 (1989-08-01), Siebert
patent: 4950548 (1990-08-01), Furusawa et al.
patent: 5270552 (1993-12-01), Ohnishi et al.
patent: 5410172 (1995-04-01), Koizumi et al.
patent: 5411631 (1995-05-01), Hori et al.
patent: 5462762 (1995-10-01), Onuma et al.
patent: 5610392 (1997-03-01), Nagayama et al.
patent: 5637445 (1997-06-01), Machida et al.
patent: 5645909 (1997-07-01), Kobayashi et al.
patent: 5665980 (1997-09-01), Onuma et al.
patent: 5842387 (1998-12-01), Marcus et al.
patent: 6008491 (1999-12-01), Smentkowski et al.
patent: 6054333 (2000-04-01), Bensaoula
patent: 6214107 (2001-04-01), Kitabatake
patent: 6270573 (2001-08-01), Kitabatake et al.
patent: 6273950 (2001-08-01), Kitabatake
patent: 6534240 (2003-03-01), Hoshi
patent: 6614532 (2003-09-01), Power et al.
patent: 6791320 (2004-09-01), Hasegawa et al.
patent: 6830863 (2004-12-01), Wachi et al.
patent: 6914244 (2005-07-01), Alani
patent: 2004/0217286 (2004-11-01), Alani
patent: 2004/0232330 (2004-11-01), Uenishi et al.
patent: 7-285275 (1995-10-01), None
“63th Applied Physics Scientific Lecture Meeting Proceedings,” Man et al, Lecture No. 27a-Q-5 (2002).

Affiliated with

Also associated with

Rating

Thin film analyzing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin film analyzing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin film analyzing method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3578764