Thin channel FET with recessed source/drains and extensions

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device

Reexamination Certificate

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C257S347000, C438S164000

Reexamination Certificate

active

06924517

ABSTRACT:
A field effect transistor (FET), integrated circuit (IC) chip including the FETs and a method of forming the FETS. The devices have a thin channel, e.g., an ultra-thin (smaller than or equal to 10 nanometers (10 nm)) silicon on insulator (SOI) layer. Source/drain regions are located in recesses at either end of the thin channel and are substantially thicker (e.g., 30 nm) than the thin channel. Source/drain extensions and corresponding source/drain regions are self aligned to the FET gate and thin channel.

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