Thickness control method and double side polisher

Abrading – Precision device or process - or with condition responsive... – Computer controlled

Reexamination Certificate

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Details

C451S010000, C451S011000, C451S041000, C451S262000, C451S269000, C451S287000

Reexamination Certificate

active

07147541

ABSTRACT:
The object of the present invention is to provide a double side polisher capable of maintaining thickness control accuracy over a long period of time without being affected by a gradual change in thickness of a polishing pad, and a thickness control method. The first polishing operation is finished based on the polishing duration time, and the second and subsequent polishing operations are finished based on the measured distance values of a distance sensor, and after each polishing operation including the first polishing, the measured value of the distance sensor is calibrated based on the measured value and target value of finishing thickness of the work piece. Since the calibration is performed for each polishing operation, it is possible to maintain thickness control accuracy over a long period of time.

REFERENCES:
patent: 4272924 (1981-06-01), Masuko et al.
patent: 4433510 (1984-02-01), Katagiri et al.
patent: 5099614 (1992-03-01), Arai et al.
patent: 6062949 (2000-05-01), Yashiki et al.
patent: 6726525 (2004-04-01), Kato et al.
patent: 6887127 (2005-05-01), Nishikawa et al.
patent: 7001242 (2006-02-01), Birang et al.
patent: 7004816 (2006-02-01), Saitoh
patent: 7008308 (2006-03-01), Bjelopavlic et al.
patent: 2002/0115387 (2002-08-01), Wenski et al.
patent: 56-146666 (1981-11-01), None
patent: 57-076406 (1982-05-01), None
patent: 63-062673 (1988-03-01), None
patent: 02-224968 (1990-09-01), None
patent: 10-034529 (1998-02-01), None
patent: 10-202514 (1998-08-01), None
patent: 2000-127031 (2000-05-01), None
patent: 2003-117809 (2003-04-01), None

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