4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package

John A. Costello

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Method of smoothing patterned transparent electrode stripes in t

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
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Thick film copper metallization for microwave power transistor p

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Patent

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Profile ID: LFUS-PAI-P-908441

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