Thermosetting resin and prepreg and laminate using the same

Details Thermosetting resin and prepreg and laminate using the same Thermosetting resin and prepreg and laminate using the same

1989-06-19

1990-06-12

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428245, 428413, 428418, 428457, 428462, 428901, 361397, 174256, B32B 900

Patent

active

049332287

ABSTRACT:
A thermosetting resin composition comprising a special poly(p-hydroxystyrene) derivative resin and a radical polymerization initiator, and if necessary an epoxy modified polybutadiene, can provide prepregs and laminates having a low dielectric constant, a shorter signalling delay time, good heat resistance and flame retardancy and thus being suitable for producing multilayer printed circuit boards.

REFERENCES:
patent: 3884992 (1975-05-01), Shimuzu et al.
patent: 4784917 (1988-11-01), Tawara et al.

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