Thermosetting resin and prepreg and laminate using the same

Details Thermosetting resin and prepreg and laminate using the same Thermosetting resin and prepreg and laminate using the same

1987-02-17

1989-12-12

Ziegler, Jacob

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

1563069, 428209, 526346, 526347, 525241, 525250, 525263, 525276, 525281, 525285, 525288, 525312, 5253288, 5253333, C08F 1208, C08F 1212, C08F26502

Patent

active

048868582

ABSTRACT:
A thermosetting resin composition comprising a special poly(p-hydroxystyrene) derivative resin and a radical polymerization initiator, and if necessary an epoxy modified polybutadiene, can provide prepregs and laminates having a low dielectric constant, a shorter signalling delay time, good heat resistance and flame retardancy and thus being suitable for producing multilayer printed circuit boards.

REFERENCES:
patent: 2915511 (1959-12-01), Blanchette
Journal of Polymer Science, Polymer chemistry edition, vol. 12, No. 10, 1974, p. 2453, John Wiley & Sons, Inc., New York, U.S.; P. Ferruti et al.: "1-methacryloylimidazole as methacrylating agent".

Affiliated with

Also associated with

Rating

Thermosetting resin and prepreg and laminate using the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermosetting resin and prepreg and laminate using the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermosetting resin and prepreg and laminate using the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2122182