Thermosetting polyimide composition, thermoset product thereof a

Details Thermosetting polyimide composition, thermoset product thereof a Thermosetting polyimide composition, thermoset product thereof a

1992-12-21

1995-03-28

Seidleck, James J.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525436, 525928, 525425, 528353, C08L 7906

Patent

active

054018129

ABSTRACT:
A thermosetting polyimide composition is provided with a sufficient heat resistance and excellent mechanical and electrical characteristics in toughness, flexibility and so on and under severe environmental conditions, by adding to a polyfunctional unsaturated imide a thermosetting resin selected from the group consisting of polyetherimide, polyarylate and polyamideimide which are in a miscibility region with the polyfunctional unsaturated imide and have an excellent glass transition point and a number-average molecular weight of more than 10,000.

REFERENCES:
patent: 4816526 (1989-03-01), Bristowe
patent: 4908409 (1990-03-01), Oikawa
patent: 4985509 (1991-01-01), Matuura
patent: 4987207 (1991-01-01), Yamaya
patent: 5037689 (1991-08-01), Boyd
patent: 5206340 (1993-04-01), Tsutsumi
K. Yamanaka et al. ("Yamanaka I"), Structure Development in Epoxy Resin Modified With Poly(ether sulphone), Polymer, pp. 662-667 (1989).
K. Yamanaka et al. ("Yamanaka I"), Reaction-Induced Phase Separation in Rubber-Modified Epoxy Resins, Polymer, vol. 60, pp. 1839-1844 (1989).

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