4. Plastic and nonmetallic article shaping or treating: processes
  5. Forming articles by uniting randomly associated particles
  6. Agitating to form larger particles

Taro Fukui

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Chip package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Chip package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Chip package structure and process for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Reexamination Certificate

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Composition of cyanate ester, epoxy resin and acid anhydride

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Reexamination Certificate

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Epoxy resin sealing material for molding semiconductor chip and

Plastic and nonmetallic article shaping or treating: processes – Forming articles by uniting randomly associated particles – Agitating to form larger particles
Patent

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Profile ID: LFUS-PAI-P-1213000

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