Thermoplastic plug method of fabricating an integrated circuit p

Details Thermoplastic plug method of fabricating an integrated circuit p Thermoplastic plug method of fabricating an integrated circuit p

1986-01-21

1987-07-14

Czaja, Donald E.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

65 36, 65 43, 156323, B32B 3120

Patent

active

046800751

ABSTRACT:
An integrated circuit package is fabricated by assembling a stack which is comprised of a plurality of thin flat epoxy-glass layers, adhesive layers between the epoxy-glass layers, and a staircase-shaped cavity. This cavity extends from an outer epoxy-glass layer to an internal epoxy-glass layer and goes parallel along a portion of the flat surface of the internal epoxy-glass layer and then penetrates through it. Conductors lie on the internal epoxy-glass layer, including bonding pads on the flat surface portions. After the stack is assembled, a plug is inserted into its cavity. This plug is thermoplastic; and it fits snugly into the cavity and extends over a larger area outside the cavity. While the plug is in the cavity, the stack is laminated at a temperature and pressure which causes the plug to soften and conform to the exact shape of the cavity. This dams the adhesive from flowing onto the bonding pads.

REFERENCES:
patent: 3622419 (1971-11-01), London et al.
patent: 3840424 (1974-10-01), Morrison
patent: 4249977 (1981-02-01), Bartholomew
patent: 4296456 (1981-10-01), Reid
patent: 4513355 (1985-04-01), Schroeder et al.

Affiliated with

Also associated with

Rating

Thermoplastic plug method of fabricating an integrated circuit p does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermoplastic plug method of fabricating an integrated circuit p, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermoplastic plug method of fabricating an integrated circuit p will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1426441