Thermography test method and apparatus for bonding...

Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test

Reexamination Certificate

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Details

C374S120000, C374S130000, C374S057000, C356S399000

Reexamination Certificate

active

07425093

ABSTRACT:
A method and apparatus for thermographically evaluating the bond integrity of a sputtering target assembly is described. The method includes applying a heating or cooling medium or energy to one surface of the assembly and acquiring a graphic recording of a corresponding temperature change on the opposing surface of the assembly using an imaging device. Also described is a method of mathematically analyzing the pixel data recorded in each frame to produce an integrated normalized temperature map that represents the bond integrity of the assembly.

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English translation of Office Action from Chinese Patent Application No. 200480023364.6, eight pages.

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