Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test
Reexamination Certificate
2008-09-16
2008-09-16
Verbitsky, Gail (Department: 2855)
Thermal measuring and testing
Leak or flaw detection
With heating or cooling of specimen for test
C374S120000, C374S130000, C374S057000, C356S399000
Reexamination Certificate
active
10890378
ABSTRACT:
A method and apparatus for thermographically evaluating the bond integrity of a sputtering target assembly is described. The method includes applying a heating or cooling medium or energy to one surface of the assembly and acquiring a graphic recording of a corresponding temperature change on the opposing surface of the assembly using an imaging device. Also described is a method of mathematically analyzing the pixel data recorded in each frame to produce an integrated normalized temperature map that represents the bond integrity of the assembly.
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English translation of Office Action from Chinese Patent Application No. 200480023364.6, eight pages.
Ellison Larry Edwin
Kachalov Mikhail Y.
White, III John D.
Wickersham, Jr. Charles E.
Zhang Zhiguo
Cabot Corporation
Verbitsky Gail
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