Thermoelectric module and manufacturing method for same

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

Reexamination Certificate

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C430S319000, C205S125000

Reexamination Certificate

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08084191

ABSTRACT:
A thermoelectric module and method of manufacture thereof, capable of preventing short-circuits between electrodes due to solder without causing increases in size or cost. A thermoelectric module is configured with lower electrodes formed on the inside surface of a lower substrate, placed in opposition to an upper substrate, on the inside surface of which are formed upper electrodes; the end faces of thermoelectric elements are soldered to the lower electrodes and upper electrodes. Each of the electrodes is configured from three layers, which are a copper layer, a nickel layer formed on one face of the copper layer, and a gold layer formed on one face of the nickel layer; a visor portion, protruding outward, is formed in the nickel layer, so that when positioning the thermoelectric elements above the electrodes and soldering the electrodes to the thermoelectric elements, the flowing of solder18afrom the side portions of electrodes to the insulating substrate is prevented.

REFERENCES:
patent: 2005/0146060 (2005-07-01), Suzuki
patent: 2005/0241690 (2005-11-01), Tajima et al.
patent: 2-205081 (1990-08-01), None
patent: 3-263882 (1991-11-01), None
patent: 2003-100983 (2003-04-01), None
patent: 2004-140250 (2004-05-01), None
patent: 2004-193355 (2004-07-01), None
patent: 2005-136075 (2005-05-01), None

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