Thermal measuring and testing – Temperature measurement – By electrical or magnetic heat sensor
Patent
1996-12-30
1999-02-09
Fulton, Christopher M.
Thermal measuring and testing
Temperature measurement
By electrical or magnetic heat sensor
136230, G01K 702, H01L 3502
Patent
active
058684972
ABSTRACT:
A thermocouple for use in an apparatus for manufacturing a semiconductor device having two metal wires, each composed of a different material, being connected at one end. A first insulator extends a first length from the connected end of the metal wires and electrically insulates a portion of one of the metal wires. A second insulator, having a brittleness factor less than that of the first insulator, extends a second length from the first insulator along the same metal wire. The lifetime of the thermocouple can be lengthened and productivity of the semiconductor device can be enhanced.
REFERENCES:
patent: 2625573 (1953-01-01), Connell
patent: 2999121 (1961-09-01), Mead
patent: 3232794 (1966-02-01), Korton
patent: 3283580 (1966-11-01), Nanigian et al.
patent: 3357250 (1967-12-01), Lowdermilk
patent: 3501957 (1970-03-01), Jones, Jr.
patent: 3643509 (1972-02-01), Surinx
patent: 4018624 (1977-04-01), Rizzolo
patent: 4217463 (1980-08-01), Swearingen
patent: 4752770 (1988-06-01), St. Pierre
patent: 5520461 (1996-05-01), Curry et al.
Akimovich, I.N. et al., "Tungsten-rhenium Thermocouple for Oxidizing Media," Meas. Tech (USA), vol. 14, No. 7 (Jul. 1971).
Fulton Christopher M.
Samsung Electronics Co,. Ltd.
LandOfFree
Thermocouple for use in an apparatus for manufacturing a semicon does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermocouple for use in an apparatus for manufacturing a semicon, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermocouple for use in an apparatus for manufacturing a semicon will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1944334